SEMINAR ON INTEGRATED POWER ELECTRONIC : In power electronics, solid state electronics is used to control and conversion of electricity. The goal of power electronics is to achieve Power conversion of energy source to an electrical load in a very efficient, reliable and affordable. Power Electronics Module units are essential for power electronics system. These modules contain integration of switches and associated electronics to drive control and protection, and other passive components. In recent decades, power generation equipment was by-generation improvements and can now deal with a significant power density. You Packing power other electronic devices has not kept pace with the The development of semiconductor devices. This is due to the limitations power electronics circuits. The integration of power electronics circuit very different from other electronic circuits. The objective of power electronic electronic circuit is the transformation of energy and very power management and thermal management. Most active electronic power modules are The wire-bonding technology [1,2]. These seed packets active die holder is mounted on a common platform and the combined wire bonds. Other electronic circuits was installed in a number of PCB layer and the devices connected to the uprights. These wires bonds are likely to resistance, parasitic and fatigue fracture. Because of its two three-dimensional structure of the package is large. Another disadvantage is Ringing sound produced by the parasitic bond wire.
To improve performance and reliability of power electronics packages, the wire ties should be replaced. Research in power electronics Packing led to the development of advanced packaging technique, which can replace wire bonds. This new generation of packaging called "Integrated Power Electronics Module (IPEM) [1]. Here, Planar metalization is used instead of conventional wire bonds. It uses technical integration in three dimensions that can provide high density, low profile systems. It offers high frequency operation and improved performance. It also reduces the size, weight and cost of power modules
To improve performance and reliability of power electronics packages, the wire ties should be replaced. Research in power electronics Packing led to the development of advanced packaging technique, which can replace wire bonds. This new generation of packaging called "Integrated Power Electronics Module (IPEM) [1]. Here, Planar metalization is used instead of conventional wire bonds. It uses technical integration in three dimensions that can provide high density, low profile systems. It offers high frequency operation and improved performance. It also reduces the size, weight and cost of power modules
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